World Library  
Flag as Inappropriate
Email this Article

System in package

Article Id: WHEBN0004093822
Reproduction Date:

Title: System in package  
Author: World Heritage Encyclopedia
Language: English
Subject: List of Intel Core i3 microprocessors, List of Intel Pentium microprocessors, List of Intel Core i5 microprocessors, Three-dimensional integrated circuit, Through-silicon via
Collection:
Publisher: World Heritage Encyclopedia
Publication
Date:
 

System in package

A system in package (SiP) or system-in-a-package, also known as a Chip Stack MCM. A SiP is a number of integrated circuits enclosed in a single module (package). The SiP performs all or most of the functions of an electronic system, and are typically used inside a mobile phone, digital music player, etc. Dies containing integrated circuits, may be stacked vertically on a substrate. They are internally connected by fine wires that are bonded to the package. Alternatively, with a flip chip technology, solder bumps are used to join stacked chips together.

SiP dies can be stacked vertically or tiled horizontally, unlike slightly less dense multi-chip modules, which place dies horizontally on a carrier. SiP connects the dies with standard off-chip wire bonds or solder bumps, unlike slightly denser three-dimensional integrated circuits which connect stacked silicon dies with conductors running through the die.

Many different 3-D packaging techniques have been developed for stacking many more-or-less standard chip dies into a compact area.[1]

An example SiP can contain several chips—such as a specialized processor, DRAM, flash memory—combined with passive components—resistors and capacitors—all mounted on the same substrate. This means that a complete functional unit can be built in a multi-chip package, so that few external components need to be added to make it work. This is particularly valuable in space constrained environments like MP3 players and mobile phones as it reduces the complexity of the printed circuit board and overall design. Despite its benefits, this technique decreases the yield of fabrication since any defective chip in the package will result in a non-functional packaged integrated circuit, even if all other modules in that same package are functional.

Suppliers

See also

References

  1. ^ R. Wayne Johnson; Mark Strickland; David Gerke. "3-D Packaging: A Technology Review". 2005.
This article was sourced from Creative Commons Attribution-ShareAlike License; additional terms may apply. World Heritage Encyclopedia content is assembled from numerous content providers, Open Access Publishing, and in compliance with The Fair Access to Science and Technology Research Act (FASTR), Wikimedia Foundation, Inc., Public Library of Science, The Encyclopedia of Life, Open Book Publishers (OBP), PubMed, U.S. National Library of Medicine, National Center for Biotechnology Information, U.S. National Library of Medicine, National Institutes of Health (NIH), U.S. Department of Health & Human Services, and USA.gov, which sources content from all federal, state, local, tribal, and territorial government publication portals (.gov, .mil, .edu). Funding for USA.gov and content contributors is made possible from the U.S. Congress, E-Government Act of 2002.
 
Crowd sourced content that is contributed to World Heritage Encyclopedia is peer reviewed and edited by our editorial staff to ensure quality scholarly research articles.
 
By using this site, you agree to the Terms of Use and Privacy Policy. World Heritage Encyclopedia™ is a registered trademark of the World Public Library Association, a non-profit organization.
 


Copyright © World Library Foundation. All rights reserved. eBooks from Project Gutenberg are sponsored by the World Library Foundation,
a 501c(4) Member's Support Non-Profit Organization, and is NOT affiliated with any governmental agency or department.